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Continuous film formation of different metal types is also possible! "Sputtering process"

Metal thin films are formed from roll to roll on various substrates.

At Kawamura Industries, we perform sputtering processing of copper, nichrome alloy, and chromium on various substrates. If greater adhesion is required, we can propose pre-treatment using our plasma treatment. **Features of Kawamura Industries' "Sputtering Processing"** - Roll to roll sputtering processing → Example of copper sputtering: thickness 0.1 to 0.2 μm - Capable of continuous film formation with different metal types → Multiple cathodes used - Supports sputtering of copper, nichrome alloy, and chromium *For target materials other than those mentioned above, please consult us. *For more details, please refer to the PDF document or feel free to contact us.

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